Silicon radars and smart algorithms: a unique combination for disruptive innovation in perceptive IoT systems
Nora Maene - imec
Perceptive IoT systems are cyber-physical systems with perception and connectivity capabilities on par or superior to those of humans. Thanks to these capabilities, they can seamlessly blend into our everyday environments, creating a fully intuitive IoT. The autonomous car is a very well-known example that combines cutting edge sensing and processing capabilities with the latest wireless connectivity to this effect. When technology cost comes down and manufacturing volumes go up, plenty more applications will emerge, leading to truly smart cities, infrastructure, homes and industrial environments.
Radar is such a sensing technique currently undergoing dramatic reduction of cost, power consumption and form factor combined with an increase in resolution and algorithmic capabilities. These advances are driven by semiconductor technology scaling and machine learning improvements. In this talk, we will address both those aspects and review recent developments in 79GHz and 140 GHz CMOS radar as well as in advanced machine learning capabilities.
High-End Sensors & Sensor Systems: How to achieve high metrological performances
Sergey Yurish - International Frequency Sensor Association
The presentation will describe modern developments and trends in the field of high-end sensors and sensor systems design. Its background is based on programmable parameter-to-frequency (time) converters as a digital sensor’s core and structural-algorithmic methods for data extraction in order to move from a traditional analog-to-digital conversion to alternative frequency (period, duty-cycle, time interval)-to-digital conversion. Working in the frequency-time signal domain simplifies design, and obviates some technical and technological problems, due to the properties of frequency as an informative parameter of sensors and transducers. The major benefits offered by such an approach are high reliability, high metrological performance, wide functionality, cost effectiveness and scalability. Different examples of high-end sensors and sensor systems will be given and discussed in details.
Secure & intelligent sensing for smart building and city solutions
Marianne Vandecasteele - imec
A safe and efficient infrastructure is the foundation on which an economy is built and is allowing us to adapt to the pressures of rapid urbanization, climate change, and other trends; To come to such an infrastructure it is a must to combine advances in sensors, controls, and software. The talk will focus on required advances in sensors for smart building solutions and how these will make informed operating practices possible and in this way maximize benefits to human health and well-being while minimizing energy consumption. Monitoring the air quality and making the data that’s relevant available, is the first step towards awareness and developing such a system wide solution. To achieve this goal, measuring sufficient spatial and temporal data is critical and hence dense sensor networks are needed. The talk will outline the state-of-the-art in gas sensors for air quality monitoring networks and considers emerging and potential future developments.
Challenges for Optical and IR Sensors for Future Defence Aircraft
Henry White - BAE Systems
Military air platforms are a challenging environment for sensing systems. The system requirements are increasing as sophisticated pilot assisted systems as well as complete autonomous operation mature. Increased emphasis on stealthy aircraft restricts the use of active systems and place significant demand on the physical realisation. Threats that need to be detected are becoming more challenging in terms of their signature and the distances over which they need to be detected. The presentation will discuss these challenges in relation to optical and IR sensors and how technology developments are required to address them.
High Performance Fiber Sensing using Integrated Photonics
Pim Kat - Technobis
Integrated photonics is emerging as an enabling and exciting technology platform for fiber sensing solutions. The ability to replace traditional assemblies of multiple discrete optical or micro-optical components by a single small sized chip, make Photonic Integrated Circuits (PICs) increasingly favorable for next generation fiber sensing systems. Technobis commercially delivers unprecedented performances and manufacturing competences in fiber sensing. The versatility of capabilities, miniature footprint and low cost has a huge market potential, not only for new next generation systems but also complimentary to existing metrology systems.
Presentation title to be confirmed.
Nigel Clarke - Jaguar Land Rover
Considerations in IoT Technologies
Johan Pedersen - Sigma Designs
The Internet of Things technology has been advancing, and consequently growing across residential, commercial and industrial spaces. It is poised to make an impact as it reaches mass adoption, but for this to occur, the technologies behind it need to be optimized for connectivity, security, interoperability and considering future advancement and uses. The Z-Wave communications protocol dominates the residential IoT market with smart home products, and is paving the way for security responsibility. Z-Wave is now protected by the Security 2 (S2) framework, which was developed with the hacker community. S2 comes within the Z-Wave system-on-chip, so manufacturers don’t have to learn or deploy extra security measures to secure devices. These steps can serve as a model as other industries develop. In this talk, Johan Pedersen from Sigma Designs will examine the considerations needed in designing IoT technologies, including interoperability, security and future features.
Fiber optic ultra high temperature (1000°C) vibration sensors
Nicholas Burgwin - Fibos
Accelerometers used to monitor component vibration are increasingly being placed in harsh environmental conditions. Vibration monitoring, such as turbine blade or exhaust vibration, require measurements to be made in elevated temperature environments that well exceed the acceptable operating conditions of traditional piezoelectric accelerometers. Fibos has developed the worlds first ultra high temperature accelerometer that can operate up to 1000°C (~1800°F) utilizing a fiber optic sensor. This presentation will dive into the details of how the accelerometer is made, evaluate the performance characteristics of it, and highlight other benefits of the optical sensing element such as EMI immunity.
VCSEL Pilot Line for ranging and 3D gesture control sensors
Iwan Davies - VIDaP Consortium
VCSELs are key components enabling many fast growing markets, including optical sensors. As GaAs-based semiconductor components, they can be processed cost-efficiently, resembling LED processing: IQE is the manufacturer of epitaxial material, while Philips has a production line for front-end and back-end processing. One pilot-line end customer, STm, designs VCSELs into Time-of-Flight sensor products, capable of making accurate distance measurements, based on the round-trip travel time of photons between the VCSEL and a CMOS sensor. Uses for ToF using VCSELs ranges from advanced proximity sensors to 3D gesture detection modules, benefiting e.g. smartphone/tablets, laptops/monitors, consumer robotics, gaming, security & building management and automotive.
Sensing is life: The survival of the fittest in high end sensing
Rainer Minixhofer - AMS AG
Sensors are a source of a constant stream of data about our environment, our habits and even our health. Together with the digitalization revolution, new challenges in the way this data is processed, stored and reported to the user are surfacing. An overview on the sensor solutions in vertical markets like wearables, smart home, medical electronics, industrial automation, connected cars and smart cities is given. The overall structure of the value chain splitting into integration services, software applications and infrastructure, connectivity and hardware will also be described. The current sensor architectures in terms of key system blocks like sensor, actuator, energy management, memory, processing and wireless connectivity is reviewed. Finally an extrapolation to future solutions and their system block architecture is given, leading to an overview on how theses systems will evolve in the next few years. New sensor functions and their application are identified and the key aspect of combination of multiple sensor raw data processing and combination is reviewed.
MEMS sensors for high volume consumer applications
Bernhard Straub - Infineon Technologies
MEMS sensors are a key enabler for the trend towards smaller and cheaper sensors. Given this trend, more and more highly sophisticated sensors enter the consumer area and drive the “sensorfication” of our world. On this path, performance must not been scarified and stable production for highest volume applications such as smart phones must be ensured. But since the appearance of the Internet of Things (IoT) MEMs sensor suppliers are faced with another challenge. IoT devices are showing up everywhere and are radically changing how we do business and interact with the world around us. Devices equipped with intelligent semiconductors sensors are forming the foundation of the smart, secure and power efficient IoT that is developing around us. The "smartness" of these systems is achieved by stretching the boundaries of current design and technology. Intelligent devices are interconnected in ways that were not possible a few years ago and Artificial Intelligence (AI) algorithms are being used to process vast amounts of sensor data. The combination of reliable high volume MEMs production, deep sensor system know-how and advanced algorithm capabilities will be key success factors for semiconductor sensor suppliers in the future.
Meeting Energy Demand for IoT Sensors with Solid State Batteries
Denis Pasero - Ilika Technologies
As the number of wireless IoT sensors is ever increasing and their dimensions are ever decreasing, the availability of energy dense power sources is critical. A solution for low-maintenance, autonomous power combines energy harvesters with small size, long life energy storage devices to provide 24/7 operation. This presentation will review alternatives for the use of energy harvesting (solar, thermal, vibration) and compare available energy storage solutions such as conventional batteries (primary or secondary), super-capacitors, Li-polymer batteries and solid state batteries such as Ilika’s Stereax, in use cases ranging across Industrial IoT, Smart Automotive, MedTech, Smart Homes and Cities.
Presentation title to be confirmed.
Speaker TBC - Evatec
Miniaturization challenges in optical sensing
Sergio Nicoletti - CEA-Leti: MIRPHAB
The Mid-IR spectral range has been considered as the paradigm for innovative silicon photonic devices because of the growing potential in spectroscopy, materials processing, chemical and biomolecular sensing, security and industry applications. This talk will discuss the challenges of the miniaturization and the co-integration of photonics devices at chip and packaging level to address cost, size and power consumption. This approach is now pursued by the MIRPHAB Pilot Line which is offering access for fast prototyping and series fabrication of sensing devices.
Quantum Well Hall Effect (QWHE) sensors for Non- Destructive Imaging applications.
Mohamed Missous - University of Manchester
A new class of highly sensitive Quantum Well Hall Effect (QWHE) sensors have been developed and commercialised. These magnetic sensors include single, linear and 2D arrays magnetovision systems. DC and AC magnetic fields can be measured with magnetic and spatial resolutions of < 50nT and 0.5mm respectively. Using specially integrated AC illumination coils, these magnetic cameras can be used to detected defects and flaws in magnetic and nonmagnetic materials. Using advanced DSP and high-resolution ADCs, the systems can increase AC and DC magnetic field scanning frame rate and reconstruct images by measuring AC magnetic field at different frequencies.
The promise of digital olfaction
Tristan Rousselle - Aryballe Technologies
Nanostructure based semiconductor gas sensors for advanced medical applications
Mrinal Pal - Central Glass and Ceramic Research Institute
Sensors have become an indispensible part of our society and can be found in various industries including chemical, food processing, pharmaceutical. Gas sensor based breath analyzers have attracted increasing interest among the scientific, technological and clinical communities. This is a non-invasive technique which can provide information of diseases and monitoring of therapy just analyzing exhale breath. There exists a huge market for gas sensors which is ever increasing due to new application possibilities including non-invasive breath analysis for monitoring diseases. Metal oxide semiconductor (SnO2, ZnO, WO3, CuO, NiO etc.) and some composite materials have been explored to produce highly sensitive and selective sensor for application in specific sensing regimes. However, the ability to prepare novel material having high sensitivity, good resolution at sub-ppm level and insensitivity towards moisture is currently not achievable. Human breath is composed of several gasses and hundreds of volatile organic compounds (VOCs). An accurate detection of specific gas /VOCs in exhaled breath, known as biomarkers, can provide essential information for the diagnosis of those diseases. The compounds of interest (VOCs) are generally found at ppb /sub-ppm level in healthy human breath which can increase several times in the breath of patients. This presentation will cover all the aspects starting from preparation of novel nanocomposites to fabrication and performance of prototype device in detail.
Photonic integrated circuits for LiDAR
Iñigo Artundo - VLC Photonics
Speeding innovation for industry with CPS (Cyber Physical Systems) - from microsensors to low power embedded HW/SW systems
Pierre-Damien Berger - CEA-Leti
CyberPhysical Systems enhance high End Sensor by providing a full and complete solution. CPSs are systems that link the physical world (e.g., through sensors or actuators) with the virtual world of information processing. They are composed from diverse constituent parts that collaborate to create some global behaviour. These constituents will include software systems, communications technology, and sensors/actuators that interact with the real world, often including embedded technologies. CEA LETI, leader in this domain masters all the different blocks, microsystem & high-end sensors like MEMS, and all the parts to enable the right solution for the application required by the industrial partners. CEA LETI is also leading European Projects providing opportunities for companies to develop their own solution.
Physical, chemical and biological sensors: meeting requirement in various industries
Diego Reyes - Innovative Sensor Technology
Sensors from physical to chemical and biological and their role in demanding applications are described. Challenges in the development, production and quality control vary significantly according to sensor type and application. Some examples on what to consider when dealing with different industries and their requirements are discussed. Furthermore, a special view on innovations and a reflection on the importance of developing more sensor technologies will be given to enable sensor industry growth also in the future.
The Open Architecture of Smart Sensor Suites
Wilmuth Muller - Fraunhofer IOSB
Military user requirements define the strong need for smart sensor suites comprising different multi-spectral imaging sensors as core elements as well as the use of additional non imaging sensors. The smart sensors suites as part of a reconnaissance and surveillance network will allow optimizing the use of various information sources for improving the situation awareness of military commanders. In our study an open architecture of smart sensor suites has been designed, which has as starting point a set of system requirements. The open system architecture, based on a system-of-systems approach enables the combination of different sensors in multiple physical configurations, like distributed sensors, co-located sensors combined in a single package, sensors mounted on a tower, sensors integrated in a platform, and use of trigger sensors. The mode of operation is adaptable to a series of scenarios with respect to relevant objects of interest, activities to be observed, available transmission bandwidth, etc. The open system architecture has been designed in accordance with the NATO Architecture Framework NAF, v3.1.
Wafer processing techniques for sensing applications in consumer electronics
Martin Eibelhuber - EV Group
Sensors in consumer electronics are mainly dominated by the MEMS industry as they can provide solutions for a multitude of applications with the high performance and smallest form factors. Wafer bonding is an enabling technology for MEMS sensors as it allows not only the encapsulation of thousands of devices in a single step but is also key to the device performance itself. For example, wafer bonding allows hermetic sealing, encapsulation of defined gas mixtures, defined pressure or vacuum while providing the highest reliability.
In addition to incorporating an ever-increasing number of MEMS sensors, today’s consumer electronic products also require novel solutions for environmental, health and optical sensing. Optical sensing in particular has recently gained a lot of momentum for 3D sensing, biometric authentification and spectral imaging. As a result, wafer processing techniques for optical components and stacks, such as lens molding and nanoimprint lithography, have become key to achieving widespread implementation of these novel optical sensing solutions.