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High End Sensors 2018 International Conference

10th-11th April 2018, Brussels, Belgium

THREE cutting edge complimentary conferences and ONE dedicated exhibition featuring leading players from across the globe

Registration at one conference allows access to other conference sessions

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Speakers Include

Infineon
Bernhard Straub
Fraunhofer IOSB
Wilmuth Muller
Fibos
Nicholas Burgwin
Tyndall National Institute
Peter O'Brien
Cadence
Ian Dennison
IFSA
Sergey Yurish
VIDaP
Iwan Davies
University of Manchester
Mohamed Missous
IST AG
Diego Reyes
VLC Photonics
Iñigo Artundo
BAE Systems
Henry White
Ilika Technologies
Denis Pasero
CEA-Leti
Sergio Nicoletti
AMS AG
Rainer Minixhofer
imec
Nora Maene
Technobis
Pim Kat
Airbus
Olivier Sornique
Yole Développement
Guillaume Girardin
EV Group
Martin Eibelhuber
Sigma Designs
Joep van Eijden

SPEAKERS INCLUDE

Bernhard Straub, Infineon Technologies
Wilmuth Muller, Fraunhofer IOSB
Nicholas Burgwin, Fibos
Peter O'Brien, Tyndall National Institute
Ian Dennison, Cadence Design Systems

Sergey Yurish, International Frequency Sensor Association
Iwan Davies, VIDaP Consortium
Mohamed Missous, University of Manchester
Diego Reyes, Innovative Sensor Technology
Iñigo Artundo, VLC Photonics

Henry White, BAE Systems
Denis Pasero, Ilika Technologies
Sergio Nicoletti, CEA-Leti: MIRPHAB
Rainer Minixhofer, AMS AG
Nora Maene, imec

Pim Kat, Technobis
Olivier Sornique, Airbus
Guillaume Girardin, Yole Développement
Martin Eibelhuber, EV Group
Joep van Eijden, Sigma Designs

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High-End Sensors: Market Opportunities

10th-11th April 2018, Brussels, Belgium

Co-located with the CS International and PIC International

2 days, 10 topics

High-End Sensors: Market Opportunities

10th-11th April, 2018, sheraton brussels airport hotel, Belgium

TEN IN-DEPTH CONFERENCE TOPICS

The presentations will be covering ten key topics which collectively provide complete coverage for High-End Sensors: Market Opportunities.


Speakers Include

Olivier Sornique
Rainer Minixhofer
Tristan Rousselle
Henry White
Ian Dennison
Pierre-Damien Berger
Sergio Nicoletti
Martin Eibelhuber
Maurus Tschirky
Nicholas Burgwin
Wilmuth Muller
Denis Pasero
Nora Maene
Bernhard Straub
Diego Reyes
Sergey Yurish
Joep van Eijden
Pim Kat
Peter O'Brien
Mohamed Missous
Iwan Davies
Iñigo Artundo
Guillaume Girardin

3 Conferences, 2 Days, 1 Exhibition

HES International

High-end sensor devices are an increasingly significant share of the global machine sensory market that is expected to exceed 30 billion devices by 2020 with revenue of (USD) $20 billion. We will explore opportunities for the most advanced sensors that deliver higher performance, ruggedness and longer operational lifetimes. We will examine new technologies that are cutting costs while increasing effectiveness. We will explore product development within major high-end sensor categories and ways that researchers and manufacturers are investigating to enhance performance, reduce power consumption, and improve efficiency.

Compound Semiconductor International

The 8th CS International conference will build on the success of its predecessors, with industry-leading insiders delivering more than 30 presentations spanning five sectors.

Together, these talks will detail breakthroughs in device technology; offer insights into the current status and the evolution of compound semiconductor devices; and provide details of advances in tools and processes that will help to drive up fab yields and throughputs.

Attendees at this two-day conference will gain an up-to-date overview of the status of the CS industry, and have opportunities to meet many other key players within this community.

Photonic Integrated Circuits International

Sales of PICs are soaring, with their deployment helping to boost the capacity of networks and data centres. To aid this industry, we are strengthening the relationships between the makers and the users of these integrated circuits by organising the 3nd PIC International, a global conference dedicated to this industry.

Attendees to the conference will hear industry-leading insiders delivering more than 30 presentations spanning five sectors. The conference will equip the delegates with an up-to-date overview of the status of the PIC industry, and provided them with many opportunities to meet other key players within this community.

3/2/1
THREE cutting edge complimentary conferences and ONE dedicated exhibition featuring leading players from across the globe.

Access to 3
Registration at one conference allows access to all other conference sessions


Platinum


Gold


Agenda Sponsor


Portfolio


Lanyard


Networking Reception


Lunch/Dinner/Drinks


Wi-Fi


Media Sponsor


Supported By

Book your place today - 3 events, 2 days, 1 ticket
The must attend conference for all professionals involved within the high-end sensor market.